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Add SnapEDA parts (AP2112K, BQ24040, MAX17048, MCP1640, MT3608, SK6812) and fix TS3425UA-3x4x2.5-160

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Import SnapEDA-sourced symbols/footprints/3D models for a handful of
power and LED parts. Also corrects the TS3425UA-3x4x2.5-160 tactile
switch: courtyard was undersized (used the simplified 4.2x3.4mm
headline package size instead of the full 5.2x3.35mm mechanical
envelope), datasheet/sourcing metadata was empty, and no 3D model was
present -- now verified against the official SHOUHAN/CAX mechanical
drawing and LCSC C51927439, with a real STEP body added.

Co-Authored-By: Claude Sonnet 5 <noreply@anthropic.com>
Claude-Session: https://claude.ai/code/session_01GjmdnB2SyPYKHbSq9Lasmr
This commit is contained in:
michele
2026-09-09 23:19:23 +02:00
co-authored by Claude Sonnet 5
parent 804e2a2cb8
commit 554a2a784f
30 changed files with 42861 additions and 35 deletions
Download Patch File Download Diff File Expand all files Collapse all files
footprints/other/MAX17048G_T10.pretty/MAX17048G_T10_SON50P200X200X80-9N.kicad_mod
+45
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(footprint SON50P200X200X80-9N (layer F.Cu) (tedit 6AA08CD0)
(descr "")
(attr smd)
(fp_text reference REF** (at 1.365 -2.017 0) (layer F.SilkS)
(effects (font (size 1.0 1.0) (thickness 0.15)))
)
(fp_text value SON50P200X200X80-9N (at 10.255 2.017 0) (layer F.Fab)
(effects (font (size 1.0 1.0) (thickness 0.15)))
)
(pad 1 smd roundrect (roundrect_rratio 0.125) (at -0.985 -0.75) (size 0.76 0.27) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
(pad 2 smd roundrect (roundrect_rratio 0.125) (at -0.985 -0.25) (size 0.76 0.27) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
(pad 3 smd roundrect (roundrect_rratio 0.125) (at -0.985 0.25) (size 0.76 0.27) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
(pad 4 smd roundrect (roundrect_rratio 0.125) (at -0.985 0.75) (size 0.76 0.27) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
(pad 5 smd roundrect (roundrect_rratio 0.125) (at 0.985 0.75) (size 0.76 0.27) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
(pad 6 smd roundrect (roundrect_rratio 0.125) (at 0.985 0.25) (size 0.76 0.27) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
(pad 7 smd roundrect (roundrect_rratio 0.125) (at 0.985 -0.25) (size 0.76 0.27) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
(pad 8 smd roundrect (roundrect_rratio 0.125) (at 0.985 -0.75) (size 0.76 0.27) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
(pad 9 smd rect (at 0.0 0.0) (size 0.9 1.3) (layers F.Cu F.Mask) (solder_mask_margin 0.102))
(fp_poly
(pts
(xy -0.28 -0.41)
(xy 0.28 -0.41)
(xy 0.28 0.41)
(xy -0.28 0.41)
) (layer F.Paste) (width 0.01)
)
(fp_circle (center -1.945 -0.75) (end -1.845 -0.75) (layer F.SilkS) (width 0.2))
(fp_circle (center -1.945 -0.75) (end -1.845 -0.75) (layer F.Fab) (width 0.2))
(fp_line (start -1.05 -1.05) (end 1.05 -1.05) (layer F.Fab) (width 0.127))
(fp_line (start -1.05 1.05) (end 1.05 1.05) (layer F.Fab) (width 0.127))
(fp_line (start -1.05 -1.205) (end 1.05 -1.205) (layer F.SilkS) (width 0.127))
(fp_line (start -1.05 1.205) (end 1.05 1.205) (layer F.SilkS) (width 0.127))
(fp_line (start -1.05 -1.05) (end -1.05 1.05) (layer F.Fab) (width 0.127))
(fp_line (start 1.05 -1.05) (end 1.05 1.05) (layer F.Fab) (width 0.127))
(fp_line (start -1.615 -1.3) (end 1.615 -1.3) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.615 1.3) (end 1.615 1.3) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.615 -1.3) (end -1.615 1.3) (layer F.CrtYd) (width 0.05))
(fp_line (start 1.615 -1.3) (end 1.615 1.3) (layer F.CrtYd) (width 0.05))
(model ${KIPRJMOD}/3dmodels/other/MAX17048G_T10.step
(offset (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)