micheleandClaude Sonnet 5
554a2a784f
Import SnapEDA-sourced symbols/footprints/3D models for a handful of power and LED parts. Also corrects the TS3425UA-3x4x2.5-160 tactile switch: courtyard was undersized (used the simplified 4.2x3.4mm headline package size instead of the full 5.2x3.35mm mechanical envelope), datasheet/sourcing metadata was empty, and no 3D model was present -- now verified against the official SHOUHAN/CAX mechanical drawing and LCSC C51927439, with a real STEP body added. Co-Authored-By: Claude Sonnet 5 <noreply@anthropic.com> Claude-Session: https://claude.ai/code/session_01GjmdnB2SyPYKHbSq9Lasmr
46 lines
2.7 KiB
Plaintext
46 lines
2.7 KiB
Plaintext
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(footprint SON50P200X200X80-9N (layer F.Cu) (tedit 6AA08CD0)
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(descr "")
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(attr smd)
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(fp_text reference REF** (at 1.365 -2.017 0) (layer F.SilkS)
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(effects (font (size 1.0 1.0) (thickness 0.15)))
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)
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(fp_text value SON50P200X200X80-9N (at 10.255 2.017 0) (layer F.Fab)
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(effects (font (size 1.0 1.0) (thickness 0.15)))
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)
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(pad 1 smd roundrect (roundrect_rratio 0.125) (at -0.985 -0.75) (size 0.76 0.27) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
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(pad 2 smd roundrect (roundrect_rratio 0.125) (at -0.985 -0.25) (size 0.76 0.27) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
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(pad 3 smd roundrect (roundrect_rratio 0.125) (at -0.985 0.25) (size 0.76 0.27) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
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(pad 4 smd roundrect (roundrect_rratio 0.125) (at -0.985 0.75) (size 0.76 0.27) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
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(pad 5 smd roundrect (roundrect_rratio 0.125) (at 0.985 0.75) (size 0.76 0.27) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
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(pad 6 smd roundrect (roundrect_rratio 0.125) (at 0.985 0.25) (size 0.76 0.27) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
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(pad 7 smd roundrect (roundrect_rratio 0.125) (at 0.985 -0.25) (size 0.76 0.27) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
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(pad 8 smd roundrect (roundrect_rratio 0.125) (at 0.985 -0.75) (size 0.76 0.27) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
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(pad 9 smd rect (at 0.0 0.0) (size 0.9 1.3) (layers F.Cu F.Mask) (solder_mask_margin 0.102))
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(fp_poly
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(pts
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(xy -0.28 -0.41)
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(xy 0.28 -0.41)
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(xy 0.28 0.41)
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(xy -0.28 0.41)
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) (layer F.Paste) (width 0.01)
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)
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(fp_circle (center -1.945 -0.75) (end -1.845 -0.75) (layer F.SilkS) (width 0.2))
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(fp_circle (center -1.945 -0.75) (end -1.845 -0.75) (layer F.Fab) (width 0.2))
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(fp_line (start -1.05 -1.05) (end 1.05 -1.05) (layer F.Fab) (width 0.127))
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(fp_line (start -1.05 1.05) (end 1.05 1.05) (layer F.Fab) (width 0.127))
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(fp_line (start -1.05 -1.205) (end 1.05 -1.205) (layer F.SilkS) (width 0.127))
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(fp_line (start -1.05 1.205) (end 1.05 1.205) (layer F.SilkS) (width 0.127))
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(fp_line (start -1.05 -1.05) (end -1.05 1.05) (layer F.Fab) (width 0.127))
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(fp_line (start 1.05 -1.05) (end 1.05 1.05) (layer F.Fab) (width 0.127))
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(fp_line (start -1.615 -1.3) (end 1.615 -1.3) (layer F.CrtYd) (width 0.05))
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(fp_line (start -1.615 -1.3) (end -1.615 1.3) (layer F.CrtYd) (width 0.05))
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(fp_line (start 1.615 -1.3) (end 1.615 1.3) (layer F.CrtYd) (width 0.05))
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(model ${KIPRJMOD}/3dmodels/other/MAX17048G_T10.step
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(offset (xyz 0 0 0))
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(scale (xyz 1 1 1))
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(rotate (xyz 0 0 0))
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)
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)
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