Files
periscope/tests
michele ad21d00cd0 Fix PE-BOM-011: classify footprint vias as vias, not pads.
KiCad stitching/thermal vias inside a footprint are (via) or copper-only
thru_hole (pad) objects. parse_kicad_pcb was appending every (pad) to
LayoutFootprint.pads, so PE-BOM-011 compared datasheet pin_count to via
numbers. Nested vias join LayoutGraph.vias; soldered THT pads stay pads.
2026-09-20 16:06:10 +02:00
..
2026-07-16 21:29:45 -07:00