micheleandClaude Sonnet 5
33738d156f
- Import LFE5U-45F-8BG381I as a proper named/valued SamacSys symbol
(symbol, footprint, 3D model) instead of relying on the generic
ECP5U_45_CABGA381 placeholder, so it's findable by exact MPN in the
Symbol Chooser. Dedupe the vendor STEP file (byte-identical to the
one already added for the BG381 package) and repoint the footprint's
bare, unresolvable "LFE5U-45F-8BG381I.stp" model reference to
${KIPRJMOD}/3dmodels/fpga_cpld/LFE5U-45F-8BG381I.step.
- Also make the existing 9-unit ECP5U_45_CABGA381 symbol (split by
bank, easier to use on a schematic than the flat SamacSys one)
findable under the same MPN: Value/manf# set to LFE5U-45F-8BG381I
after verifying its 381 CABGA381 ball assignments match the SamacSys
symbol 1:1, and link its Footprint to the newly imported footprint.
- Import IS66WVE4M16EBLL-70BLI (SamacSys) symbol, footprint and 3D
model.
Co-Authored-By: Claude Sonnet 5 <noreply@anthropic.com>
Claude-Session: https://claude.ai/code/session_013gndCxJXQfouCQy4hP7NSX
83 lines
7.1 KiB
Plaintext
83 lines
7.1 KiB
Plaintext
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(footprint BGA48C75P8X6_800X600X120N (layer F.Cu) (tedit 6A9866B6)
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(descr "")
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(attr smd)
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(fp_text reference REF** (at -0.825 -5.635 0) (layer F.SilkS)
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(effects (font (size 1.0 1.0) (thickness 0.15)))
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)
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(fp_text value BGA48C75P8X6_800X600X120N (at 11.875 5.635 0) (layer F.Fab)
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(effects (font (size 1.0 1.0) (thickness 0.15)))
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)
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(pad A1 smd circle (at -1.875 -2.625) (size 0.33 0.33) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
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(pad A2 smd circle (at -1.125 -2.625) (size 0.33 0.33) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
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(pad A3 smd circle (at -0.375 -2.625) (size 0.33 0.33) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
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(pad A4 smd circle (at 0.375 -2.625) (size 0.33 0.33) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
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(pad A5 smd circle (at 1.125 -2.625) (size 0.33 0.33) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
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(pad A6 smd circle (at 1.875 -2.625) (size 0.33 0.33) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
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(pad B1 smd circle (at -1.875 -1.875) (size 0.33 0.33) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
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(pad B2 smd circle (at -1.125 -1.875) (size 0.33 0.33) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
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(pad B3 smd circle (at -0.375 -1.875) (size 0.33 0.33) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
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(pad B4 smd circle (at 0.375 -1.875) (size 0.33 0.33) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
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(pad B5 smd circle (at 1.125 -1.875) (size 0.33 0.33) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
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(pad B6 smd circle (at 1.875 -1.875) (size 0.33 0.33) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
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(pad C1 smd circle (at -1.875 -1.125) (size 0.33 0.33) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
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(pad C2 smd circle (at -1.125 -1.125) (size 0.33 0.33) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
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(pad C3 smd circle (at -0.375 -1.125) (size 0.33 0.33) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
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(pad C4 smd circle (at 0.375 -1.125) (size 0.33 0.33) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
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(pad C5 smd circle (at 1.125 -1.125) (size 0.33 0.33) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
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(pad C6 smd circle (at 1.875 -1.125) (size 0.33 0.33) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
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(pad D1 smd circle (at -1.875 -0.375) (size 0.33 0.33) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
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(pad D2 smd circle (at -1.125 -0.375) (size 0.33 0.33) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
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(pad D3 smd circle (at -0.375 -0.375) (size 0.33 0.33) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
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(pad D4 smd circle (at 0.375 -0.375) (size 0.33 0.33) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
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(pad D5 smd circle (at 1.125 -0.375) (size 0.33 0.33) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
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(pad D6 smd circle (at 1.875 -0.375) (size 0.33 0.33) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
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(pad E1 smd circle (at -1.875 0.375) (size 0.33 0.33) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
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(pad E2 smd circle (at -1.125 0.375) (size 0.33 0.33) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
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(pad E3 smd circle (at -0.375 0.375) (size 0.33 0.33) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
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(pad E4 smd circle (at 0.375 0.375) (size 0.33 0.33) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
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(pad E5 smd circle (at 1.125 0.375) (size 0.33 0.33) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
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(pad E6 smd circle (at 1.875 0.375) (size 0.33 0.33) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
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(pad F1 smd circle (at -1.875 1.125) (size 0.33 0.33) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
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(pad F2 smd circle (at -1.125 1.125) (size 0.33 0.33) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
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(pad F3 smd circle (at -0.375 1.125) (size 0.33 0.33) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
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(pad F4 smd circle (at 0.375 1.125) (size 0.33 0.33) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
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(pad F5 smd circle (at 1.125 1.125) (size 0.33 0.33) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
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(pad F6 smd circle (at 1.875 1.125) (size 0.33 0.33) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
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(pad G1 smd circle (at -1.875 1.875) (size 0.33 0.33) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
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(pad G2 smd circle (at -1.125 1.875) (size 0.33 0.33) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
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(pad G3 smd circle (at -0.375 1.875) (size 0.33 0.33) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
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(pad G4 smd circle (at 0.375 1.875) (size 0.33 0.33) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
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(pad G5 smd circle (at 1.125 1.875) (size 0.33 0.33) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
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(pad G6 smd circle (at 1.875 1.875) (size 0.33 0.33) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
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(pad H1 smd circle (at -1.875 2.625) (size 0.33 0.33) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
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(pad H2 smd circle (at -1.125 2.625) (size 0.33 0.33) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
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(pad H3 smd circle (at -0.375 2.625) (size 0.33 0.33) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
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(pad H4 smd circle (at 0.375 2.625) (size 0.33 0.33) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
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(pad H5 smd circle (at 1.125 2.625) (size 0.33 0.33) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
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(pad H6 smd circle (at 1.875 2.625) (size 0.33 0.33) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102))
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(fp_circle (center -3.5 -2.625) (end -3.4 -2.625) (layer F.SilkS) (width 0.2))
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(fp_circle (center -3.5 -2.625) (end -3.4 -2.625) (layer F.Fab) (width 0.2))
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(fp_line (start 3.0 4.0) (end -3.0 4.0) (layer F.Fab) (width 0.127))
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(fp_line (start 3.0 -4.0) (end -3.0 -4.0) (layer F.Fab) (width 0.127))
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(fp_line (start 3.0 4.0) (end 3.0 -4.0) (layer F.Fab) (width 0.127))
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(fp_line (start -3.0 4.0) (end -3.0 -4.0) (layer F.Fab) (width 0.127))
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(fp_line (start 3.0 4.0) (end 1.525 4.0) (layer F.SilkS) (width 0.127))
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(fp_line (start 3.0 4.0) (end 3.0 2.025) (layer F.SilkS) (width 0.127))
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(fp_line (start -3.0 4.0) (end -1.525 4.0) (layer F.SilkS) (width 0.127))
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(fp_line (start -3.0 4.0) (end -3.0 2.025) (layer F.SilkS) (width 0.127))
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(fp_line (start -3.0 -4.0) (end -1.525 -4.0) (layer F.SilkS) (width 0.127))
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(fp_line (start -3.0 -4.0) (end -3.0 -2.025) (layer F.SilkS) (width 0.127))
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(fp_line (start 3.0 -4.0) (end 1.525 -4.0) (layer F.SilkS) (width 0.127))
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(fp_line (start 3.0 -4.0) (end 3.0 -2.025) (layer F.SilkS) (width 0.127))
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(fp_line (start -4.0 5.0) (end 4.0 5.0) (layer F.CrtYd) (width 0.05))
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(fp_line (start -4.0 -5.0) (end 4.0 -5.0) (layer F.CrtYd) (width 0.05))
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(fp_line (start -4.0 5.0) (end -4.0 -5.0) (layer F.CrtYd) (width 0.05))
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(fp_line (start 4.0 5.0) (end 4.0 -5.0) (layer F.CrtYd) (width 0.05))
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(model ${KIPRJMOD}/3dmodels/memory/IS66WVE4M16EBLL-70BLI.step
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(offset (xyz 0 0 0))
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(scale (xyz 1 1 1))
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(rotate (xyz 0 0 0))
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)
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)
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